Bonded MEMS Mirrors

Bonded Mirrors are fabricated separately from the silicon actuator structure and are intended for subsequent microassembly on top of devices. Because these mirrors are attached from above the device actuator structure, they do not occupy a part of the actuator area and therefore can be essentially made in arbitrary sizes. The Bonded Mirrors methodology allows users to select the size, as well as the geometry of mirrors for each individual application, in order to optimize the trade-offs between speed, beam size, and scan angle. Mirrors are bonded onto ready-made actuators, providing the ability to economically adapt a small set of fabricated devices for a wide range of applications.

  • Bonded Mirror Sizes: 2.0, 2.4, 3.0, 3.6, 4.2, 4.6mm, and 5.0mm, 6.4mm, and 7.5mm diameter in stock.
  • Maximum tilt angle under point-to-point driving: -6° to +6° mechanical on each axis, varies with design type, and in some cases is limited by mirror size.
  • Maximum tilt angle under resonant driving: -7° to +7° mechanical, in some cases limited by mirror size.
  • Single-Axis Option: In-stock single-axis actuators can be combined with many of the available mirror sizes.

These are example characterization reports of typical devices of a given design as made at manufacture time. Most designs have additional full datasheets available upon request to

Actuator NameMechanical Angle [°]Die Size [mm]Mirror Diameter [mm]
A7B1.3±75.20 x 5.20NRNRNRNRNR
A7B2.3±65.20 x 5.20NRNRNRNRNRNR
A8L2.2±57.25 x 7.25NRNRNRNR
A5L3.3(C2)±4.257.25 x 7.25NR
A5L3.3±2.57.25 x 7.25NR
A5L2.2±1.157.25 x 7.25
* = Datasheet Not Available
* NR = Not Recommended